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d a t a sh eet product speci?cation supersedes data of 2000 jun 26 2000 sep 05 discrete semiconductors kmi15/1 integrated rotational speed sensor handbook, halfpage m3d282 4 .com u datasheet
2000 sep 05 2 philips semiconductors product speci?cation integrated rotational speed sensor kmi15/1 features digital current output signal zero speed capability wide air gap wide temperature range insensitive to vibration emc resistant. description the kmi15/1 sensor detects rotational speed of ferrous gear wheels and reference marks (1) . the sensor consists of a magnetoresistive sensor element, a signal conditioning integrated circuit in bipolar technology and a magnetized ferrite magnet. the frequency of the digital current output signal is proportional to the rotational speed of a gear wheel. pinning (1) the sensor contains a customized integrated circuit. usage in hydraulic brake systems and in systems with active brake control is forbidden. for all other applications, higher temperature versions of up to 150 c are available on request. caution do not press two or more products together against their magnetic forces. pin description 1v cc 2v - fig.1 simplified outline (sot453b). handbook, halfpage mbh781 12 quick reference data symbol parameter min. typ. max. unit v cc dc supply voltage - 12 - v i cc (low) current output signal low - 7 - ma i cc (high) current output signal high - 14 - ma d sensing distance 0 to 2.5 0 to 2.9 - mm f t operating tooth frequency 0 - 25000 hz t amb ambient operating temperature - 40 - +85 c 4 .com u datasheet
2000 sep 05 3 philips semiconductors product speci?cation integrated rotational speed sensor kmi15/1 limiting values in accordance with absolute maximum rating system (iec 60134). characteristics t amb =25 c; v cc = 12 v; d = 2.1 mm; f t = 2 khz; test circuit: see fig.7; r l = 115 w ; sensor positioning: see fig.15; gear wheel: module 2 mm; material 1.0715; unless otherwise speci?ed. note 1. high rotational speeds of wheels reduce the sensing distance due to eddy current effects (see fig.17). symbol parameter conditions min. max. unit v cc dc supply voltage t amb = - 40 to +85 c; r l = 115 w- 0.5 +16 v t stg storage temperature - 40 +150 c t amb ambient operating temperature - 40 +85 c t sld soldering temperature t 10 s - 260 c output short-circuit duration to gnd continuous symbol parameter conditions min. typ. max. unit i cc (low) current output signal low see figs 6 and 8 5.6 7 8.4 ma i cc (high) current output signal high see figs 6 and 8 11.2 14 16.8 ma t r output signal rise time c l = 100 pf; see fig.9; 10 to 90% value - 0.5 -m s t f output signal fall time c l = 100 pf; see fig.9; 10 to 90% value - 0.7 -m s t d switching delay time between stimulation pulse (generated by a coil) and output signal - 1 -m s f t operating tooth frequency for both rotation directions 0 - 25000 hz d sensing distance see fig.15 and note 1 0 to 2.5 0 to 2.9 - mm d duty cycle see fig.6 30 50 70 % 4 .com u datasheet
2000 sep 05 4 philips semiconductors product speci?cation integrated rotational speed sensor kmi15/1 functional description the kmi15/1 sensor is sensitive to the motion of ferrous gear wheels or reference marks. the functional principle is shown in fig.3. due to the effect of flux bending, the different directions of magnetic field lines in the magnetoresistive sensor element will cause an electrical signal. because of the chosen sensor orientation and the direction of ferrite magnetization, the kmi15/1 is sensitive to movement in the y direction in front of the sensor only (see fig.2). the magnetoresistive sensor element signal is amplified, temperature compensated and passed to a schmitt trigger in the conditioning integrated circuit (figs 4 and 5). the digital output signal level (see fig.6) is independent of the sensing distance within the measuring range (fig.14). a (2-wire) output current enables safe transfer of the sensor signal to the detecting circuit (see fig.7). the integrated circuit housing is separated from the sensor element housing to optimize the sensor behaviour at high temperatures. fig.2 component detail of the kmi15/1. handbook, halfpage y z xx ic sensor magnet with direction of magnetization mbh778 fig.3 functional principle. handbook, full pagewidth gear wheel magnet magnetic field lines (a) (b) (c) direction of motion (d) mra957 sensor y z 4 .com u datasheet
2000 sep 05 5 philips semiconductors product speci?cation integrated rotational speed sensor kmi15/1 fig.4 block diagram. handbook, full pagewidth schmitt trigger amplifier sensor switchable current source constant current source voltage control v cc v mra958 fig.5 simplified circuit diagram. handbook, full pagewidth power supply gap v ref v cc v schmitt- trigger pre- amplifier emc filter sensor mra959 switchable current source constant current source 4 .com u datasheet
2000 sep 05 6 philips semiconductors product speci?cation integrated rotational speed sensor kmi15/1 fig.6 output signal as a function of time. handbook, halfpage i cc t t t p mra960 14 ma 7 ma d t p t --- - 100% = fig.7 test and application circuit. mra961 v c r sensor gnd cc i cc l l v application information fig.8 output current levels as functions of ambient temperature; typical values. handbook, halfpage 12 10 16 4 14 8 6 (ma) 50 0 50 100 150 200 v cc = 12 v v cc = 8 v v cc = 20 v v cc = 12 v v cc = 8 v v cc = 20 v i mra967 t amb ( o c) i cc cc(high) i cc(low) fig.9 output current switching times as functions of ambient temperature; typical values. v cc = 12 v; c l = 100 pf; r l = 115 w . handbook, halfpage 0 50 100 150 200 0.6 0.4 0.2 1 0 0.8 t f t r t f t r i cc t mra968 t (s) t amb ( c) o m 50 4 .com u datasheet
2000 sep 05 7 philips semiconductors product speci?cation integrated rotational speed sensor kmi15/1 mounting conditions the recommended sensor position in front of a gear wheel is shown in fig.15. the distance d is measured between the sensor front and the tip of a gear wheel tooth. the kmi15/1 senses ferrous indicators like gear wheels in the y direction only (no rotational symmetry of the sensor); see fig.2. the effect of incorrect mounting positions on sensing distance is shown in figs 11, 12 and 13. the symmetrical reference axis of the sensor corresponds to the axis of the ferrite magnet. environmental conditions due to eddy current effects the sensing distance depends on the tooth frequency (fig.17). the influence of gear wheel module on the sensing distance is shown in fig.16. gear wheel dimensions note 1. for conversion from asa to din: m = 25.4 mm/dp; p = 25.4 mm cp. symbol description unit german din z number of teeth d diameter mm m module m = d/z mm p pitch p = p mmm asa; note 1 pd pitch diameter (d in inch) inch dp diametric pitch dp = z/pd inch - 1 cp circular pitch cp = p /dp inch fig.10 gear wheel dimensions. handbook, halfpage pitch pitch diameter mra964 pitch = module p module pitch diameter number of teeth ----------------------------------------- - = fig.11 sensing distance as a function of positional tolerance in the y-axis; typical values. v cc = 12 v; f t = 2 khz; module = 2 mm; pitch diameter = 100 mm. handbook, halfpage 1 2 4 3 01234 0 d (mm) mra998 d y (mm) y 4 .com u datasheet
2000 sep 05 8 philips semiconductors product speci?cation integrated rotational speed sensor kmi15/1 fig.12 sensing distance as a function of positional tolerance; typical values. v cc = 12 v; f t = 2 khz; module = 2 mm. handbook, halfpage 1 2 4 3 01 0 d (mm) mra999 d q 234 q (deg) fig.13 sensing distance as a function of positional tolerance in the x-axis; typical values. v cc = 12 v; f t = 2 khz; module = 2 mm. handbook, halfpage mra982 x (mm) 1 2 4 3 0 x d 10 mm d (mm) 024 6 - 2 - 4 - 6 fig.14 sensing distance as a function of ambient temperature; typical values. v cc = 12 v; f t = 2 khz; module = 2 mm. handbook, halfpage 1 2 4 3 - 50 0 50 100 150 200 0 t amb ( o c) d (mm) mra962 d fig.15 sensor positioning. handbook, halfpage gear wheel sensor d d mra963 4 .com u datasheet
2000 sep 05 9 philips semiconductors product speci?cation integrated rotational speed sensor kmi15/1 fig.16 normalized maximum sensing distance as a function of gear wheel module; typical values. d o = measuring distance for a gear wheel with module m = 2 mm. h andbook, halfpage module m (mm) 1 0.5 1.5 0 0 12 3 4 5 d mra966 d 0 fig.17 sensing distance as a function of tooth frequency; typical values. v cc = 12 v; module = 2 mm. handbook, halfpage 1 2 4 3 01234 0 d (mm) mra965 d f t tooth frequency f (khz) 4 .com u datasheet
2000 sep 05 10 philips semiconductors product speci?cation integrated rotational speed sensor kmi15/1 emc figure 18 shows a recommended application circuit for automotive applications (wheel sensing f t < 5 khz). it provides a protection interface to meet electromagnetic compatibility (emc) standards and safeguard against voltage spikes. table 1 lists the tests which are applicable to this circuit and the achieved class of functional status. protection against load dump (test pulse 5 according to din 40839 ) means a very high demand on the protection circuit and requires a suitable suppressor diode with sufficient energy absorption capability. the board net often contains a central load dump protection that makes such a device in the protection circuit of the sensor module unnecessary. tests for electrostatic discharge (esd) were conducted in line with iec 801-2 to demonstrate the kmi15/1s handling capabilities. the iec 801-2 test conditions were: c = 150 pf, r = 150 w , v = 2 kv. electromagnetic disturbances with fields up to 150 v/m and f = 1 ghz (ref. din 40839 ) have no influence on performance. table 1 emc test results emc ref. din 40839 symbol min. (v) max. (v) remarks class test pulse 1 v ld - 100 - t d = 2 ms c test pulse 2 v ld - 100 t d = 0.2 ms a test pulse 3a v ld - 150 - t d = 0.1 m sa test pulse 3b v ld - 100 t d = 0.1 m sa test pulse 4 v ld - 7 - t d = 130 ms b test pulse 5 v ld - 120 t d = 400 ms b fig.18 test/application circuit for the kmi15/1. handbook, halfpage mgd805 c l r l c1 115 w 100 nf 100 nf d2 d1 bzto3g36 1n4001/3 + v gnd - v v cc sensor 4 .com u datasheet
2000 sep 05 11 philips semiconductors product speci?cation integrated rotational speed sensor kmi15/1 package outline unit b p c q l 2 l 1 v references outline version european projection issue date iec jedec eiaj mm 1.7 1.4 0.8 0.7 b p1 1.57 1.47 5.7 5.5 4.1 3.9 0.3 0.24 1.2 0.9 3.9 3.5 l 3 6.55 6.35 m 1 8.15 7.85 m 2 8.15 7.85 m 3 (1) 4.7 4.3 l 7.55 7.25 d (2) d 1 (2) 3.15 2.95 d 2 (2) 4.5 4.3 e (2) 5.7 5.5 4.6 4.4 e 1 (2) 18.2 17.8 h e 5.6 5.5 h e1 k max. 5.37 e 0.25 0.75 0.65 dimensions (mm are the original dimensions) sot453b 99-09-23 00-08-31 0 2.5 5 mm scale a (1) plastic single-ended multi-chip package; magnetized ferrite magnet (8 x 8 x 4.5 mm); 4 interconnections; 2 in-line leads sot453b e e e 1 h e1 l 1 d 2 d b p1 d 1 h e m 1 notes 1. glue thickness not included. 2. plastic or metal protrusions of 0.15 mm maximum per side are not included. l 2 b p c 12 v m ab v m ab q a k m 2 m 3 b a sensor die position * centre of reading point l 3 l 4 .com u datasheet
2000 sep 05 12 philips semiconductors product speci?cation integrated rotational speed sensor kmi15/1 data sheet status note 1. please consult the most recently issued data sheet before initiating or completing a design. data sheet status product status definitions (1) objective speci?cation development this data sheet contains the design target or goal speci?cations for product development. speci?cation may change in any manner without notice. preliminary speci?cation quali?cation this data sheet contains preliminary data, and supplementary data will be published at a later date. philips semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. product speci?cation production this data sheet contains ?nal speci?cations. philips semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 4 .com u datasheet
2000 sep 05 13 philips semiconductors product speci?cation integrated rotational speed sensor kmi15/1 notes 4 .com u datasheet
2000 sep 05 14 philips semiconductors product speci?cation integrated rotational speed sensor kmi15/1 notes 4 .com u datasheet
2000 sep 05 15 philips semiconductors product speci?cation integrated rotational speed sensor kmi15/1 notes 4 .com u datasheet
? philips electronics n.v. sca all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. internet: http://www.semiconductors.philips.com 2000 70 philips semiconductors C a worldwide company for all other countries apply to: philips semiconductors, marketing communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 3 figtree drive, homebush, nsw 2140, tel. +61 2 9704 8141, fax. +61 2 9704 8139 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101 1248, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 20 0733, fax. +375 172 20 0773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 68 9211, fax. +359 2 68 9102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 800 943 0087 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: sydhavnsgade 23, 1780 copenhagen v, tel. +45 33 29 3333, fax. +45 33 29 3905 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615 800, fax. +358 9 6158 0920 france: 51 rue carnot, bp317, 92156 suresnes cedex, tel. +33 1 4099 6161, fax. +33 1 4099 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 2353 60, fax. +49 40 2353 6300 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, via casati, 23 - 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